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*Customer:
Pb Free
SPECIFICATION
ITEM MODEL Revision No. CHIP LED DEVICE HBTGFR421-S
[Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic Diagrams 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use
Customer
Approved by Approved by Approved by
Supplier
Drawn by Checked by Approved by
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
Seoul Semiconductor HBTGFR421-S
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1. Features
Full-color lighting Package : 1.6x1.5x0.5mm, Flat molding
2. Absolute Maximum Ratings Parameter Power Dissipation Symbol Pd Color Red Green Blue Red Green Blue Red Green Blue 5 -30 ~ +85 -40 ~ +100 Value 72 68 30 20 50 35
(Ta=25) Unit
Forward Current
IF IFM*1 VR Topr Tstg
Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature
V
*1 IFM conditions: Pulse width Tw 0.1ms, Duty ratio 1/10
3. Electro-optical Characteristics Parameter Forward Voltage Symbol VF IR IV Condition IF=10 VR=5V IF=10 IF=20 IF=20 IF=20 Color Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue Min 1.7 2.7 2.7 45 80 25 615 510 465 Typ 2.2 3.1 3.1 0.1 0.1 0.1 70 140 50 625 525 470 20 35 25 150 150 150 Max 2.4 3.4 3.4 10 10 10 635 530 475 -
(Ta=25) Unit V
Reverse Current Luminous Intensity*2 Dominant Wavelength Spectral Bandwidth Viewing angle*3
mcd
d
2
1/2
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance: VF 0.1V, IV 10%, d 2nm)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
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4. Characteristic Diagrams
Forward Current vs. Forward Voltage
Luminous Intensity vs. Forward Current
100
180 160
Relative Intensity IV[%]
140 120 100 80 60 40
Forward Current IF[mA]
10
1
RED GREEN BLUE
0.1 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
20 0 0 5 10 15 20 25 30
RED GREEN BLUE
35 40
Forward Voltage VF[V]
Forward Current IF[mA]
Forward Current Derating Curve
Radiation Diagram
40 35 30 25 20 15 10 5 0 -25
90
Forward current IF[mA]
.0
Red : 0.42mA/ C
o
120
60
.8 .6 .4
Blue & Green : 0.145mA/ C
o
150
30
.2
75
o
0
25
50
100
.0
180
0.5
0.5
0
Ambient temperature Ta[ C]
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
- 3/7-
5. Soldering Profile Reflow Soldering Conditions/ Profile
(1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface temperature
C Operation heating 240
150
~
Pre-heating
Temperature rise: 5C/sec.
Cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead-Free Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 255max. for 20 seconds max.
LED Surface temperature C Operation heating 255 (+5)
150 ~ 120 0
Pre-heating
Temperature rise: 5C/sec.
Cooling: -5C/sec.
60 to 120 sec.
10 to 20 sec.
(3) Hand Soldering conditions -Not more than 3 seconds @MAX280, under Soldering iron. SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
- 4/7-
6. Outline Dimension
Anode(Common)
0.4 1.5 3 4 Marking (0.18) Resin 0.2 1
Tolerance: 0.1, Unit:
0.8 0.2 1.8
1.1
1.6
1.2
0.8
Green
PCB 2 0.8 1 0.2 0.5 0.05 0.6 2
0.4
3
4
Cathode
7. Packing
1.75 0.1
0.05
4.0 1.5
+0.1 -0
0.1
1.75
2.0 0.05
Blue
Red
0.2
0.05
0.05
3.5
4.0 0.1
0.5
0.05
1.730.05
(2.75)
8.0
0.2
0.7 0.05
180 +0 -3
11.4 9
0.3
Pb
Pb-free
(-)
(+)
2 0.2
+0.2 -0
22 13
0.2
Label
60
Tolerance: 0.2,
Unit:
(1) Quantity : 4000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10pitches to be 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
- 5/7-
2.4
8. Reel Packing Structure
Reel
P/N : # # # # # # # # # #
##
SSC-HBTGFR421-S
Lot N o
#########
: 4000
Aluminum Vinyl Bag
P/N : # # # # # # # # # #
##
SSC-HBTGFR421-S
Lot N o
#########
: 4000
Outer Box
*Material: Paper(SW3B(B)) a 7inch 245 c
CHIP LED
PART CODE Q'Y T : : 40,000 E A :
SE O UL SE MIC O N D U CT O R C O ., L T D
TYPE
SIZE(mm) b 220 c 142
: SSC-HBTGFR421-S
CHIP LED b a
LOT NO : DATE
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
- 6/7-
9. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant . Otherwise, to store them in the following environment is recommended. Temperature : 5~30 (2) Attention after opened However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5~40 Humidity : less than 30% (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 605. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. (15) Static Electricity and surge damages the Blue/Green LEDs. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be properly grounded. Humidity : 60%HR max.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
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